BGA Reballing Stencil for Nintendo Switch

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BGA Reballing Stencil for Nintendo Switch

€15.99

This metal BGA reballing stencil is made for repairing Nintendo Switch components including the BGA200, BCM4354, MAX77620A and NFCBEA chips. With a thickness of 0.12mm it allows precise reballing of solder joints. Ideal for electronics technicians and repair specialists.