BGA Reballing Stencil for Nintendo Switch
Rated 4.80/5 by 100 shoppers
€15.99
- Precision steel mesh stencil for BGA200, BCM4354, MAX77620A and NFCBEA chips
- 0.12mm thickness for accurate solder ball placement
- Designed specifically for Nintendo Switch repair work
- Made from durable metal for repeated professional use
- Supplied in protective packaging for safe storage
This metal BGA reballing stencil is made for repairing Nintendo Switch components including the BGA200, BCM4354, MAX77620A and NFCBEA chips. With a thickness of 0.12mm it allows precise reballing of solder joints. Ideal for electronics technicians and repair specialists.