Universal BGA Reballing Stencil for Phone and Laptop Chips

Name: Universal BGA Reballing Stencil for Phone and Laptop Chips
Brand: Dazed
SKU: DZD-7076
Price: 13.99 EUR
Availability: InStock
Rating: 4.80 (315 reviews)

Rated 4.80/5 by 315 shoppers

€13.99

Thickness options of 0.12 mm or 0.15 mm
Square hole design for direct heating reballing
Suitable for mobile phone, laptop CPU and IC chip repair
Reusable stencils for precise solder ball application
Comes in individual or 3-in-1 combination packs

This universal BGA reballing stencil is made for repairing phone, laptop and computer chip components. Available in 0.12 mm or 0.15 mm thickness with square holes for accurate solder placement. Essential for electronics technicians performing BGA rework.